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Total line control – A milestone to an autonomous production
Webcast
Server based software solutions collect the measurement data from all solder paste inspection (SPI) and automated optical inspection (AOI) machines across the shop floor. From there, it should provide the analytics and reporting to help manufacturers rapidly identify process anomalies in real-time and identify the ideal parameters – at the machine, through the job library, or via remote access – so the operator can verify the status of the process with a mouse-click. What’s more, the system should link the inspection data with the printer to update the print process parameters. It should also communicate with the component mounter to identify defective placement nozzles or flag a placement head for maintenance. This webinar will explain how manufacturers can use advanced software tools to analyze and optimize the process by managing data, in turn increasing quality, reducing defects, and minimizing costs.
Speaker
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Dipl.-Ing. (FH) Axel Lindloff Application Engineer Pre-Sales Koh Young Europe |
| Axel Lindloff studied general electrical engineering at the Bielefeld University of Applied Sciences and has been active in the SMT world since 1999. He initially gained 3 years of experience in sales of stencils and consumables before moving to the application department of a well-known printing machine manufacturer in 2003. Here he worked until 2012 with the optimization of existing processes, audits and the development of new printing applications. Since September 2012 Mr. Lindloff has been working for Koh Young Europe GmbH as an application engineer. |
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