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Quality control of the smallest components and solder joints present a number of challenges for electronics manufacturers. How can the time needed for shade-free and reliable inspection be minimized?
Viscom 3D AOI systems deliver the perfect solution! They combine precise defect detection with the highest inspection speed. They offer a complete 360-degree view of the PCB using 8 tilted cameras with real 3D, which means the smallest components and solder joints can be realistically displayed and reliably inspected. Viscom's vVision operating software further optimizes optical inspection using fast and intuitive inspection program creation and verification. The intelligent uplink function also ensures simple process optimization with Smart Factory connection.
Speaker:
Tino Mißbach, Head of Sales Application, Viscom AG
Grischa Wasmus, Sales Engineer, Viscom AG
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