Optimized reflow thermal profiling to minimize voiding

There are several aspects when it comes to the challenges of printed circuit board (PCB) voiding with bottom terminated components (BTCs). With miniaturization, various changes in PCB assemblies, the mixture of circuit board components, as well as different reflow processes, the struggle to find the true causes of voiding is difficult. MB Allen, Manager of KIC, explores the potential solutions to reduce PCB voiding, with a focus on thermal profiling.

To find the right PCB profile, it is key to focus on certain areas of the thermal profile. Following the most common settings for establishing a good reflow profile is also useful. Using tools available on the market for this optimization process significantly reduces the amount of time needed, including the amount of trial and error thermal profile runs. Finally, improving the knowledge base as well as sharing the know-how to others is also important when it comes to voiding issues.