– 3D-AOI Faster camera head speed available with no loss in inspection accuracy: 18um camera head at 5,700mm2/sec High rigid frame and twin motor driven system delivers high positioning accuracy Easy and simple programming yet high detection capability in inspection libraries Advanced Z-axis feature: 2D&3D inspection capability extension up to 40mm in height, improving inspection accuracy with dynamic warpage compensation and inspection availability for back-end PCBs. Quad side camera: Full inspection coverage of hidden soldering joint High detection capability and flexibility for contaminator, solder ball inspection outside of the components and pads Connectivity with AXI inspection result for better understanding of defect/ false call condition and improving judgement capabilities.
– 3D AXI Fastest capturing speed for inline 3D-CT AXI without losing high-definition image quality. Saki’s unique planar CT technology delivers large number of sliced images necessary for detecting soldering defects difficult to detect such as Void and HiP Advanced inspection algorithms for Void, HiP and other soldering defects Easy and simple programming like 3D-AOI Connectivity with 3D-AOI inspection result to understand complete picture of defect condition
– Service Reliable customer-oriented support Open to the future development and reliability of the delivery Global support footprint including local software development centers
