From mini-LED to SMT – 3D high-speed Reconstruction of Chip Components

Since entering the SMT World, we have noticed that Components are getting a little smaller every year. Even if we don’t particularly require this ourselves. The reasons lie with the Component Manufacturers and their main Customers within Consumer Electronics. For example, the Components have to fit into ever smaller Devices and become cheaper. The result is a shift in the range of Components and smaller Productions also have to face the processing of these smaller Components. This Presentation draws an arc from mini-LEDs to the current sizes and illuminates the limits of 3D Measurement within the SMT World.

Michael Zahn | Sales Manager | Koh Young Europe GmbH